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Movable Contacts
Application
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Board to Cable
Board to Board
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IC Sockets
MEMS
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Electrostatic Capacitance
Product Design
Mounting
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External Integration
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Asia Pacific(current region)
October 1st 2026
Notification
September 25th 2026
August 25th 2026
July 24th 2026
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April 15th 2026